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      Reflow soldering is achieved by re-melting paste solder pre-dispensed on printed circuit board pads to achieve soldering of the solder joints of the surface-mount component or the mechanical and electrical connection between the leads and the printed circuit board pad. .

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      Dispensing machines, also known as gluing machines, dispensing machines, gluing machines, glue filling machines, etc., specifically control fluids. The fluid can be dripped, applied on the surface of the product or inside the product's automated machine, can achieve three-dimensional, four-dimensional path dispensing, precise positioning, precise control of plastic, no drawing, no leakage of glue, not Epoxy.

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