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    • 发布时间: 2018 - 06 - 10
      价格:
      0
      市场价:
      69888
      ¥
      68888
      Laser micro cladding is also called laser direct writing and is mainly used for the manufacture of microelectronic components. In this process, functional materials such as electronic pastes are used as cladding materials. Continuous or pulsed laser irradiation is used to make the interface between the cladding material and the cladding layer physically and chemically to form the required wires and functional components. Or MEMS microstructures.
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    • The basic principle and characteristics of laser micro-cladding


      The basic principle of laser micro-cladding technology is to pre-position functional materials (such as micro- and nano-sized powders or slurries) onto functional substrates (fine glass, ceramics, organic epoxy plates, plastics, etc.) by other deposition methods such as micro-pen or micro-spraying. Single crystal silicon and other non-metallic materials), and then use special software, combined with CAD/CAM, to quickly convert the graphics file directly into a processing file, control the laser walking path, and process the functional powder or slurry layer to make the cladding material inside Physical and chemical interactions occur between the cladding layer and the substrate, and wires and passive devices with different line widths are obtained, and the conductive layer, the electric resistance layer and the dielectric layer are directly prepared on the surface of the insulating substrate without a mask.


      Laser micro-cladding is characterized by coating various functional electronic, semi-conductor or insulator pastes on the surfaces of various electronic and semiconductor substrates to form desired functional coatings. It enables rapid manufacturing of (micro)electronic components, optoelectronic devices, hybrid integrated circuit substrates, and micro-electromechanical systems. It has the advantages of high processing precision, good quality, easy realization of plane and three-dimensional processing, high flexibility, wide application range of substrates, etc. It has a broad market prospect in the fields of electronics manufacturing, precision machinery and bioengineering.

    • 工作方式

      准连续

      功率配置(可选)

      0~50W

      激光波长(可选)

      355nm、532nm、1.064mm

      微细笔直写最小宽度

      ≤60μm

      微喷直写最小宽度

      ≤20μm

      微喷/微细笔-激光复合微熔覆最小线宽

      ≤10μm

      重复定位精度

      ±0.001mm

      工作台尺寸(可选)

      标准台面:400mm×300mm×100mm

      定位

      CCD定位,具有自动涨缩补偿。

      支持加工文件格式

      AutoCAD, Protel, Gerber

      稳定性

      24小时连续工作无故障。


    • 产品名称:

      Laser micro-melting overlay

      上市日期: 2018-06-10
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